Heat dissipation assembly for computing devices

Details Heat dissipation assembly for computing devices Heat dissipation assembly for computing devices

2007-11-29

2009-06-23

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080400, C257S714000, C439S485000

Reexamination Certificate

active

07551441

ABSTRACT:
An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat sink is included which is in thermal contact with the microprocessor whereby a water barrier is applied to and proximate the socket for preventing water of condensation from contacting areas covered by the water barrier and a moisture absorbent surrounding the heat sink.

REFERENCES:
patent: 4341432 (1982-07-01), Cutchaw
patent: 5574627 (1996-11-01), Porter
patent: 6054676 (2000-04-01), Wall et al.
patent: 6166607 (2000-12-01), Schoellkopf
patent: 6840794 (2005-01-01), Chiu
patent: 7042723 (2006-05-01), Espersen et al.

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