Heat dissipation assembly for computing devices

Details Heat dissipation assembly for computing devices Heat dissipation assembly for computing devices

2007-11-06

2007-11-06

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080400, C257S714000, C439S485000

Reexamination Certificate

active

11031930

ABSTRACT:
Computing devices, including laptop computers, desk top computers, servers and video game terminals employ microprocessors which generate considerable heat. In fact, the heat generated from microprocessors is generally considered the limiting factor in computing speed. A heat sink is provided in thermal contact with a microprocessor whereby a water barrier is applied to and proximate a socket configured within the computing device's motherboard for preventing water of condensation from contacting areas covered by the water barrier.

REFERENCES:
patent: 6054676 (2000-04-01), Wall et al.
patent: 6246581 (2001-06-01), Kang et al.
patent: 6410982 (2002-06-01), Brownell et al.
patent: 6543246 (2003-04-01), Wayburn et al.
patent: 7042723 (2006-05-01), Espersen et al.

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