Heat dissipation assembly

Details Heat dissipation assembly Heat dissipation assembly

2006-09-19

2006-09-19

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S719000, C257S718000, C257S727000, C174S016100, C165S080300, C165S185000

Reexamination Certificate

active

07110261

ABSTRACT:
A heat dissipation assembly of the present invention includes a printed circuit board (50), an electronic component (60) mounted on the printed circuit board, a heat dissipation device (70) mounted on the electronic component, four securing members (10) secured to the heat dissipation device and four positioning members (20) extend through the printed circuit board. The positioning members are covered over by four resilient members (30) disposed in the securing members. The positioning members pull the securing members toward the printed circuit board.

REFERENCES:
patent: 6307748 (2001-10-01), Lin et al.
patent: 6475030 (2002-11-01), Chang
patent: 2003/0217835 (2003-11-01), Lee
patent: 2005/0141201 (2005-06-01), Chen et al.
patent: 410992 (2000-11-01), None
patent: 454899 (2001-09-01), None
patent: 461696 (2001-10-01), None
patent: 465805 (2001-11-01), None
patent: 468814 (2001-12-01), None

Affiliated with

Also associated with

Rating

Heat dissipation assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipation assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3579158