Heat dissipation assembly

Details Heat dissipation assembly Heat dissipation assembly

2006-07-13

2008-09-23

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S104330, C165S080300, C361S697000

Reexamination Certificate

active

07428153

ABSTRACT:
A heat dissipation assembly used for dissipating heat from heat generating electronic components includes a mounting frame, a heat sink and a fan duct. The heat sink is positioned on the mounting frame; the fan duct is attached to the heat sink. The fan duct includes a plurality of first clamping portions, and the mounting frame includes a plurality of second clamping portions corresponding to the first clamping portions. The first clamping portions engage with the second clamping portions to fix the fan duct and the heat sink onto the mounting frame.

REFERENCES:
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patent: 6768641 (2004-07-01), Li
patent: 6822870 (2004-11-01), Hong et al.
patent: 6940716 (2005-09-01), Korinsky et al.
patent: 7040384 (2006-05-01), Shiang-Chich
patent: 2006/0067050 (2006-03-01), Li et al.
patent: 2006/0221570 (2006-10-01), Yang et al.
patent: 2006/0238979 (2006-10-01), Liu
patent: 2580509 (2003-10-01), None

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