Heat dissipation apparatus and method

Details Heat dissipation apparatus and method Heat dissipation apparatus and method

1996-03-23

1999-06-29

Leo, Leonard

Heat exchange

With retainer for removable article

Electrical component

165 804, 165185, 174 163, 257714, 361699, H05K 720

Patent

active

059154632

ABSTRACT:
A heat dissipation apparatus (51) has a lid (12) and an optimized fin arrangement (16) located in a cavity (57) of a base (11). Semiconductor chips (41, 42, 43, 44, 45, and 46) are coupled to the lid (12), and a heat conducting medium (47) is forced into the cavity (57) through a port (13) and out of the cavity (57) through a different port (14). Heat generated by the semiconductor chips (41, 42, 43, 44, 45, and 46) is thermally conducted into the fin arrangement (16) and then transferred into the heat conducting medium (47).

REFERENCES:
patent: 3956673 (1976-05-01), Seid
patent: 3961666 (1976-06-01), Suzuki et al.
patent: 4103737 (1978-08-01), Perkins
patent: 4151548 (1979-04-01), Klein et al.
patent: 4790374 (1988-12-01), Jacoby
patent: 4802532 (1989-02-01), Dawes et al.
patent: 4858069 (1989-08-01), Hughes
patent: 4979074 (1990-12-01), Morley et al.
patent: 5022462 (1991-06-01), Flint et al.
patent: 5107397 (1992-04-01), Azar
patent: 5218516 (1993-06-01), Collins et al.
patent: 5305186 (1994-04-01), Appelt et al.
patent: 5313098 (1994-05-01), Tumpey et al.
patent: 5481433 (1996-01-01), Carter
patent: 5526231 (1996-06-01), Arz et al.
patent: 5666269 (1997-09-01), Romero et al.

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