Heat dissipation apparatus and method

Details Heat dissipation apparatus and method Heat dissipation apparatus and method

1998-12-07

2000-12-05

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361690, 361707, 361710, 361722, 361737, 257713, 257717, 165 803, 165185, 622592, 3647081, H05K 720

Patent

active

061575380

ABSTRACT:
A system includes a housing, a support structure (e.g., a circuit board), and an electronic device mounted on the support structure. A heat dissipation apparatus is thermally coupled to the electronic device and the housing to direct heat from the electronic device into the housing. The heat dissipation apparatus may include layers of thermally conductive members coupled between the electronic device and the housing. In addition, the heat dissipation apparatus may be thermally coupled to the support structure to direct heat from the electronic device to the support structure.

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