Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2002-09-18
2004-03-23
Tolin, G. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C257S719000
Reexamination Certificate
active
06711020
ABSTRACT:
CROSS-REFERENCE TO RELATED APPLICATION
This application claims the priority benefit of Taiwan application serial no. 91212992, filed Aug. 21, 2002:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates in general to a heat dissipation apparatus, and more particularly, to a heat dissipation apparatus having a main heat sink and at least one connecting heat sink. The assembly of the heat dissipation apparatus and the electric appliance is convenient, and rework can be performed on individual electronic device.
2. Related Art of the Invention
The power supply bas become an inevitable product of the prosperous computer industry. The commonly seen power supply is employed in a host of desktop computers. In addition to the lower-power power supply used in the computer, the high-power power supply for the high-level product is also under development. The heat dissipation design is particularly crucial for the power supply with high power output. In addition to the heat dissipation performance, the assembling convenience to an electric appliance and reworking of the assembly directly reflect on the cost and assemble labor consumption. Here, the process of reworking means an action that when a malfunction or other issue has been found for the device after being assembled, the device is then replaced or modified.
FIGS. 1A and 1B
show a conventional assembly of a heat dissipation apparatus and an electric appliance. As shown in
FIGS. 1A and 1B
, the electric appliance with the heat dissipation apparatus includes an electric product
100
, a heat sink
104
and several connecting members
108
. The electric product
100
has a circuit board
102
, on which at least one electronic device
106
is disposed The electronic devices
106
are the major heat generating sources. The heat generated from the electronic devices
106
is directed and dissipated by the heat sink
104
, such that the normal operation of the electric product
100
can be maintained.
Further referring to
FIGS. 1A and 1B
, while assembling the electric product
100
and the heat sink
104
, each of the electronic devices
106
is fixed on the heat sink
104
via one of the connecting members
108
. The connecting members
108
typically include screws
108
a
and nuts
108
b.
After the electronic devices
106
and the heat sink
104
are installed, the heat sink
104
including the electronic devices
106
is then installed in the electric product
100
. Such installation causes the following problems.
(1) If location error occurs to the electronic devices on the heat sink, part of the electronic devices, after the electronic devices and the circuit board are coupled, a portion of the electronic devices, due to the error of misalignment, will be damaged. Particularly, the leading pins will be damaged and then reliability or lifetime of the product will be reduced
(2) While performing reworking, all the electronic devices have to be removed from the heat sink, followed by reinstallation. However, such rework cannot completely resolve the misalignment Also and, the electronic devices, which can normally work, has possibility to be damaged during the second assembling process.
(3) As at least one electronic device is fixed on the heat sink, the electronic device has to be aligned with proper locations of the circuit board in order to perform assembly. The assembly is thus very time consuming.
SUMMARY OF THE INVENTION
The present invention provides a heat dissipation apparatus which can be installed in an electric product easily. When reworking is performed on individual electronic devices, such as replacing the device with a new one, the reworking is not necessary to be applied to the whole assembly.
The heat dissipation apparatus can be applied to dissipate heat generated by an electric product. The electric product includes a circuit board, on which at least one electronic device (heat generating sources) is formed. The heat dissipation apparatus includes a main heat sink and at least one connecting heat sink. The main heat sink is mounted on each electronic device of the circuit board, and the connecting heat sink is disposed between the electronic device and the main heat sink, such that the heat of the electronic device can be conducted to the main heat sink via the connecting heat sink.
The heat dissipation apparatus further comprises at least one connecting member connecting between the main heat sink and the connecting heat sink. The connecting member comprises screws and nuts. In addition, the connecting member includes heat conductive glue.
In the present invention, the electric product includes a power supply or other electric appliance. In addition, the electronic device of the power supply includes a chip or other active devices (heat generating sources).
REFERENCES:
patent: 3859570 (1975-01-01), Veranth et al.
patent: 5621615 (1997-04-01), Dawson et al.
patent: 5838064 (1998-11-01), Shimada et al.
patent: 5901039 (1999-05-01), Dehaine et al.
patent: 6067230 (2000-05-01), Ashida et al.
Chang Yang-Cheng
Yu Wen-Lung
Delta Electronics , Inc.
Tolin G.
Wu Charles C. H.
Wu & Cheung, LLP
LandOfFree
Heat dissipation apparatus and electric appliance using the... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipation apparatus and electric appliance using the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation apparatus and electric appliance using the... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3189341