Heat dissipation apparatus

Details Heat dissipation apparatus Heat dissipation apparatus

2005-03-15

2005-03-15

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S121000, C165S104330, C174S015200, C257S722000, C361S700000, C361S703000

Reexamination Certificate

active

06867971

ABSTRACT:
A heat dissipation apparatus is described. The heat dissipation apparatus reduces noise of a notebook computer. The apparatus comprises a heat sink, at least one heat pipe, at least one heat column, a plurality of heat exhausting fins, and at least one fan device. The heat sink catches the heat energy on the central processing unit of the notebook computer. The heat energy is transferred from the heat sink to the heat pipes, and then to the heat columns. The heat columns delivers the heat energy to the heat exhausting fins parallel to each other in a vertical direction and the fan device blows the heat out of the computer. The fan device has an outlet angle aligned with an inlet angle of the heat exhausting fins, and therefore the noise of the computer is reduced. In particular, a heat plate is coupled between the heat columns and the heat pipes. Hence, the heat can be more efficiently delivered to the heat exhausting fins directly from sidewalls of the heat exhausting fins and by way of the columns.

REFERENCES:
patent: 6348748 (2002-02-01), Yamamoto
patent: 6439299 (2002-08-01), Miyahara et al.
patent: 6550529 (2003-04-01), Horng et al.
patent: 2001-251079 (2001-09-01), None
patent: 471657 (2002-01-01), None

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