Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-06-28
2011-06-28
Chervinsky, Boris L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679470, C361S719000, C165S080400, C165S104330
Reexamination Certificate
active
07969737
ABSTRACT:
A heat dissipation apparatus includes a heat absorbing base, a heat conductive core, two fin assemblies and two heat pipes. The heat conductive core is attached to the heat absorbing base, and includes an elliptical, cylindrical body having an elliptical, cylindrical side surface. The two fin assemblies are located at two opposite sides of a major axis of the heat conductive core, respectively, and attached to the side surface of the heat conductive core. The two heat pipes connect the two fin assemblies with the heat absorbing base, respectively, transferring heat from the heat absorbing base to the fin assemblies.
REFERENCES:
patent: 7532472 (2009-05-01), Lin et al.
patent: 7576987 (2009-08-01), Lai et al.
patent: 7643293 (2010-01-01), Chu
patent: 7760501 (2010-07-01), Zha et al.
patent: 7796387 (2010-09-01), Deng et al.
patent: 7802616 (2010-09-01), Chen et al.
patent: 2007/0044942 (2007-03-01), Mou
patent: 2008/0202729 (2008-08-01), Mochizuki
patent: 2009/0242176 (2009-10-01), Liu et al.
patent: 2010/0230074 (2010-09-01), Li
Guo Qing-Lei
Yang Ming
Zhu Shou-Li
Chervinsky Boris L
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Niranjan Frank R.
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