Heat dissipation apparatus

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S679470, C361S719000, C165S080400, C165S104330

Reexamination Certificate

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07969737

ABSTRACT:
A heat dissipation apparatus includes a heat absorbing base, a heat conductive core, two fin assemblies and two heat pipes. The heat conductive core is attached to the heat absorbing base, and includes an elliptical, cylindrical body having an elliptical, cylindrical side surface. The two fin assemblies are located at two opposite sides of a major axis of the heat conductive core, respectively, and attached to the side surface of the heat conductive core. The two heat pipes connect the two fin assemblies with the heat absorbing base, respectively, transferring heat from the heat absorbing base to the fin assemblies.

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patent: 7576987 (2009-08-01), Lai et al.
patent: 7643293 (2010-01-01), Chu
patent: 7760501 (2010-07-01), Zha et al.
patent: 7796387 (2010-09-01), Deng et al.
patent: 7802616 (2010-09-01), Chen et al.
patent: 2007/0044942 (2007-03-01), Mou
patent: 2008/0202729 (2008-08-01), Mochizuki
patent: 2009/0242176 (2009-10-01), Liu et al.
patent: 2010/0230074 (2010-09-01), Li

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