Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2009-06-08
2011-12-06
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S695000, C165S080300, C415S213100
Reexamination Certificate
active
08072757
ABSTRACT:
A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted on the heat sink configured to generate airflow through the heat dissipation apparatus. The fan includes a plurality of fan blades, and a motor configured for rotating the fan. The motor is located a distance from the fan blades.
REFERENCES:
patent: 6141217 (2000-10-01), Nakahama et al.
patent: 7004236 (2006-02-01), Lee et al.
patent: 7221567 (2007-05-01), Otsuki et al.
patent: 7405934 (2008-07-01), Otsuki et al.
patent: 7424906 (2008-09-01), Bhatti et al.
patent: 7475718 (2009-01-01), Reyzin et al.
patent: 7484925 (2009-02-01), Carlson et al.
patent: 7753107 (2010-07-01), Zhou et al.
patent: 2004/0234374 (2004-11-01), Huber
patent: 2008/0087315 (2008-04-01), Deming et al.
Cao Liang-Liang
Guo Lei
Li Yang
Lin Yu-Hsu
Wu Zhi-Ping
Altis Law Group, Inc.
Chervinsky Boris
Hon Hai Precision Industry Co. Ltd.
Hong Fu Jin Precision Industry ( ShenZhen) Co., Ltd.
LandOfFree
Heat dissipation apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipation apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4272484