Heat exchange – With retainer for removable article – Electrical component
Patent
1996-09-20
1998-07-14
Leo, Leonard R.
Heat exchange
With retainer for removable article
Electrical component
361690, 361701, 165903, 165185, F28F 700
Patent
active
057789703
ABSTRACT:
A heat dissipation apparatus for dissipating heat of a semiconductor chip module is disclosed. The heat dissipation apparatus includes a base, a plurality of fins, and a heat transfer pipe. The heat transfer pipe has a first opening and a second opening. The first opening is adjacent to the fins which are arranged over the base. The second opening is in a cooling ambient. The heat generated from the semiconductor chip module is conducted away by the base, the fins and then transferred into the cooling ambient through the heat transfer pipe.
REFERENCES:
patent: 4149218 (1979-04-01), Carrubba et al.
patent: 4277816 (1981-07-01), Dunn et al.
patent: 4296455 (1981-10-01), Leaycraft et al.
patent: 4674004 (1987-06-01), Smith et al.
patent: 4953058 (1990-08-01), Harris
patent: 5218513 (1993-06-01), Brown
patent: 5535094 (1996-07-01), Nelson et al.
Hwang, U.P. et al. "Push-Pull Multi-Flow System For Air-Cooled Modules", IBM TDB, vol. 22, No. 2, Jul. 1979, pp. 696-697.
Leo Leonard R.
Mitac International Corp.
LandOfFree
Heat dissipation apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipation apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1873164