Heat dissipating type printed circuit board and structure...

Details Heat dissipating type printed circuit board and structure... Heat dissipating type printed circuit board and structure...

2007-11-13

2007-11-13

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S700000, C361S701000, C361S702000, C361S720000, C165S080300, C165S080400, C165S080500, C257S713000, C257S714000, C257S715000

Reexamination Certificate

active

11383168

ABSTRACT:
A heat dissipating type printed circuit board and its structure for conducting heat with a heat pipe include a substrate, a signal circuit disposed on a surface of the substrate and electrically coupled to an electronic component, a heat dissipating layer disposed on another surface of the substrate, and at least one heat pipe, each having a heated end and a condensing end extended from the heated end. The substrate includes a through hole passing through the heat dissipating layer, and the heat dissipating layer includes an adhering layer disposed at a surface proximate to the surroundings of the heat pipe, and a distal end of the heated end of the heat pipe is covered by the adhering layer, and the adhering layer is extended from the surface of the heat dissipating layer to a corresponding position of the electronic component.

REFERENCES:
patent: 5793611 (1998-08-01), Nakazato et al.
patent: 6008987 (1999-12-01), Gale et al.
patent: 6351385 (2002-02-01), Featherstone, III
patent: 7057895 (2006-06-01), Mejia et al.
patent: 405029717 (1993-02-01), None
patent: 411068371 (1999-03-01), None

Affiliated with

Also associated with

Rating

Heat dissipating type printed circuit board and structure... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipating type printed circuit board and structure..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating type printed circuit board and structure... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3856873