Heat-dissipating substrate for micro-electronic devices and fabr

Details Heat-dissipating substrate for micro-electronic devices and fabr Heat-dissipating substrate for micro-electronic devices and fabr

1997-10-10

1999-03-02

Mai, Ngoclan

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Consolidation of powder prior to sintering

419 39, 419 30, 419 47, B22F 312

Patent

active

058783229

ABSTRACT:
Heatsinks for microcircuit packages are formed by first mold-pressing a composite powder of free-flowing spray-dried particles of copper and at least one other denser material such as tungsten and/or molybdenum breakably agglutinated in nodules grouping sub-nodules of surface alloyed pairs of particles of each metal, the proportions of which are adjusted to match the thermal expansion characteristics of the microcircuit material. The pressed compacts are then heated in a sintering furnace at 1090.degree. C. to 1150.degree. C. in order to effect an homogeneous distribution of the melting copper throughout the structure. The process results in a readily usable component having good thermal conductivity and matched thermal expansion that requires no further machining.

REFERENCES:
patent: 3576619 (1971-04-01), Emley
patent: 5049184 (1991-09-01), Harner et al.
patent: 5413751 (1995-05-01), Polese et al.
patent: 5439638 (1995-08-01), Houck et al.

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