Heat-dissipating structure with air-guiding device

Details Heat-dissipating structure with air-guiding device Heat-dissipating structure with air-guiding device

2007-08-14

2007-08-14

Hyeon, Hae Moon (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

Reexamination Certificate

active

11113189

ABSTRACT:
A heat-dissipating structure is assembled on a Central Processing Unit, and has a water-cooling device, a fan and a support device. The support device is assembled between the water-cooling device and the fan to form an accommodating space. Hence, the heat-dissipating device can efficiently dissipate the heat from the Central Processing Unit and another electronic element that is disposed in the vicinity of the Central Processing Unit. Furthermore, the air-guiding device can guide the air from the fan to the correct place for cooling the Central Processing Unit or another electronic element.

REFERENCES:
patent: 6019165 (2000-02-01), Batchelder
patent: 6477045 (2002-11-01), Wang
patent: 6809928 (2004-10-01), Gwin et al.
patent: 6909608 (2005-06-01), Fan
patent: 2006/0219387 (2006-10-01), Atarashi et al.
patent: 2006/0268513 (2006-11-01), Sheng et al.

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