Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-07-26
2005-07-26
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S707000, C257S706000, C257S707000, C165S080300, C165S185000
Reexamination Certificate
active
06922339
ABSTRACT:
A heat dissipating structure of a printed circuit board on which a circuit pattern is provided so that a heat generating part can be mounted, and which has a through hole formed at a site where the heat generating part is mounted from a surface on which the heat generating part is mounted to the opposite surface. A heat dissipating member made of a material with a thermal conductivity higher than a board of the printed circuit board, and having a shape worked so that the heat dissipating member can be inserted into the through hole is mounted in the through hole with an adhesive interposed therebetween. Heat generated from a heat generating part is transferred by way of a heat dissipating member to as far as a conductor of the GND surface or heat dissipating fins.
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Patent Abstracts of Japan, Publication No. 05-259669, Date of Publication: Oct. 8, 1993.
Aota Takeshi
Nakamura Daisuke
Chervinsky Boris
New Japan Radio Co. Ltd.
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