Heat dissipating structure of interface card

Details Heat dissipating structure of interface card Heat dissipating structure of interface card

2007-09-18

2007-09-18

Zarroli, Michael C. (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S083000, C165S080300, C361S695000

Reexamination Certificate

active

11096948

ABSTRACT:
A heat dissipating structure of an interface card is applied in an electronic device. The structure includes a heat dissipating apparatus attached to a circuit board of the electronic device, wherein the heat dissipating apparatus comprises a heat sink and a fan received in a room of the heat sink; and an interface card electrically connected to the circuit board of the electronic device via a connector. At least a surface of the interface card that is mounted with semiconductor components is mounted on top of a part of the heat dissipating apparatus in a faced-down manner to dissipate heat generated during operations of the semiconductor components to an external environment through the heat sink and the fan.

REFERENCES:
patent: 5959836 (1999-09-01), Bhatia
patent: 6717811 (2004-04-01), Lo et al.
patent: 6775135 (2004-08-01), Lo
patent: 6937474 (2005-08-01), Lee
patent: 2005/0068727 (2005-03-01), Yu
patent: 2006/0196639 (2006-09-01), Yang et al.

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