Heat dissipating structure of integrated circuit chip of...

Details Heat dissipating structure of integrated circuit chip of... Heat dissipating structure of integrated circuit chip of...

2006-05-18

2010-02-02

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S719000, C348S058000, C313S582000

Reexamination Certificate

active

07656666

ABSTRACT:
A heat dissipating structure of an integrated circuit chip of a plasma display module and a plasma display module including the same are disclosed. In one embodiment, the heat dissipating structure includes: a chassis including a chassis base and a chassis bending portion in which at least one protruding portion is formed and the integrated circuit chip which is mounted on the cassis bending portion and connected to a signal transmitting member. According to one embodiment of the present invention, since the protruding portion is formed in the chassis bending portion on which the integrated circuit chip is formed, the convective heat transfer efficiency is increased and the heat dissipating performance of the integrated circuit chip is improved.

REFERENCES:
patent: 6198222 (2001-03-01), Chang
patent: 6366264 (2002-04-01), Kurumada
patent: 6833674 (2004-12-01), Kaneko et al.
patent: 6971780 (2005-12-01), Lee et al.
patent: 7251140 (2007-07-01), Bae et al.
patent: 7259958 (2007-08-01), Bang et al.
patent: 7262968 (2007-08-01), Chang et al.
patent: 2003/0090458 (2003-05-01), Tajima
patent: 2005/0067956 (2005-03-01), Kim
patent: 2005/0083646 (2005-04-01), Bae et al.
patent: 2005/0117304 (2005-06-01), Kim
patent: 2005/0286228 (2005-12-01), Kim
patent: 2006/0158851 (2006-07-01), Bae et al.
patent: 2006/0203143 (2006-09-01), Shin
patent: 2006/0244875 (2006-11-01), Ahn
patent: 2006/0262241 (2006-11-01), Jeong
patent: H02-121782 (1990-10-01), None
patent: 2001-013883 (2001-01-01), None
patent: 2003-115568 (2003-04-01), None
patent: 2006-195177 (2006-07-01), None
patent: 2001-0007075 (2001-01-01), None
patent: 2003-0011647 (2003-02-01), None

Affiliated with

Also associated with

Rating

Heat dissipating structure of integrated circuit chip of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipating structure of integrated circuit chip of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating structure of integrated circuit chip of... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4194360