Heat-dissipating structure of an electronic part

Details Heat-dissipating structure of an electronic part Heat-dissipating structure of an electronic part

1997-12-22

2000-08-08

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 35GC, 361719, 361818, H05K 720

Patent

active

061010928

ABSTRACT:
A heat-dissipating structure in which a cylindrical projecting portion is formed in a shield case so as to project inwardly of the shield case and contact an electronic part encased in the shield case. This heat-dissipating structure has high heat conductivity and can reduce the amount of interfering signals being emitted from or rushing into the case.

REFERENCES:
patent: 4621304 (1986-11-01), Oogaki
patent: 5099396 (1992-03-01), Barz
patent: 5227663 (1993-07-01), Patil
patent: 5468910 (1995-11-01), Knapp
patent: 5777847 (1998-07-01), Tokuno
patent: 5787976 (1998-08-01), Warren

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