Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-08-12
1998-10-27
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174 163, 361680, 361687, H05K 720
Patent
active
058285520
ABSTRACT:
A heat dissipating structure of a notebook computer, including a metal heat conductive plate mounted to the mainframe of a notebook computer and disposed in contact with the CPU and having an upright wall at the rear side, a metal coupling plate mounted on the upright wall of the metal heat conductive plate and having a horizontal U-groove at the back, a metal heat collecting panel mounted on the mainframe of the notebook computer and fastened to the coupling plate and the upright wall of the heat conductive plate by screws and having a horizontal U-groove at the front side incorporating with the horizontal U-groove of the metal coupling plate into a circular axle hole, a tubular metal revolving shaft mounted in the circular axle hole between the heat collecting panel and the coupling plate and having a plurality of mounting leaves symmetrically raised from the periphery near two opposite ends and respectively fastened to the LCD of the notebook computer, and a heat dissipating tube mounted in the revolving shaft and having two opposite ends respectively embedded in the LCD of the notebook computer.
REFERENCES:
patent: 5552960 (1996-09-01), Nelson et al.
patent: 5588483 (1996-12-01), Ishida
patent: 5621613 (1997-04-01), Haley et al.
LandOfFree
Heat dissipating structure of a notebook computer does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipating structure of a notebook computer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating structure of a notebook computer will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1618659