Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-05-13
2008-05-13
Vortman, Anatoly (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S712000, C361S714000, C348S836000
Reexamination Certificate
active
07372704
ABSTRACT:
A heat dissipating structure for an IC chip of a plasma display module, and a plasma display module having the same with improved heat dissipating performance of the IC chip while preventing the spread of foreign matter emanating from the heat-dissipating sheet. The structure includes a chassis including a chassis bending part and a chassis base, the IC chip contacting the chassis bending part and connected to a signal transmitting member, a cover plate arranged on the chassis bending part and facing the IC chip, a chip heat-dissipating sheet arranged between the IC chip and the cover plate, the chip-heat dissipating sheet made out of graphite and a thermally conductive member also arranged between the IC chip and the cover plate, the thermally conductive member adapted to contact and cover the chip heat-dissipating sheet.
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Korean Office Action for corresponding Korean Patent Application No. 2005-0036696, issued on Oct. 31, 2006.
Bushnell , Esq. Robert E.
Samsung SDI & Co., Ltd.
Thomas Bradley H
Vortman Anatoly
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