Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-03-01
2011-03-01
Datskovskiy, Michael V (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S695000, C361S697000, C165S080300
Reexamination Certificate
active
07898798
ABSTRACT:
A heat dissipating structure for an electronic component of the present invention includes a main board on which electronic components are mounted, a heat sink disposed facing the main board and contacting a plurality of the electronic components on the main board, a heat pipe disposed on the heat sink, an arm branching from the heat sink and elastically deformable in relation to the heat sink, and a cooling fan located at the end portion of the heat pipe.
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U.S. Appl. No. 12/251,803, filed Oct. 15, 2008, Sakata.
Sakata Tatsuya
Seki Kenichi
Yamauchi Toru
Yana Terutaka
Datskovskiy Michael V
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Sony Corporation
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