Heat dissipating structure for an electronic device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S688000, C361S690000, C361S704000, C361S714000, C361S721000, C165S080300, C165S185000

Reexamination Certificate

active

07099153

ABSTRACT:
A heat dissipating structure for an electronic device includes a heat source and a heat dissipating member. The heat dissipating member has an inner wall, an outer wall, and a plurality of partition walls. The inner wall receives heat transfer from the heat source. The outer wall opposes the inner wall at a distance. The partition walls connect the inner wall and the outer wall, and together with the inner wall and outer wall define a plurality of through-holes which are approximately the same shape and are aligned at roughly regular intervals along the inner wall or the outer wall. The through-holes are arranged along the vertical direction that allows most effective utilization of gravitational influence, and are open to the outside at the upper and lower ends thereof.

REFERENCES:
patent: 2965819 (1960-12-01), Rosenbaum
patent: 3236296 (1966-02-01), Dubin
patent: 3961666 (1976-06-01), Suzuki et al.
patent: 4042903 (1977-08-01), Finegan, Jr.
patent: 4095998 (1978-06-01), Hanson
patent: 4633371 (1986-12-01), Nagy et al.
patent: 4840225 (1989-06-01), Foley et al.
patent: 5089935 (1992-02-01), Ito
patent: 5218516 (1993-06-01), Collins et al.
patent: 6493224 (2002-12-01), Mottahed
patent: 2002/0122299 (2002-09-01), Kelly et al.
patent: 11-233977 (1999-08-01), None
patent: 2002-111263 (2000-04-01), None
patent: 2000-352399 (2000-12-01), None
patent: 02001291982 (2001-10-01), None
Patent Abstracts of Japan 09-212258 dated Aug. 15, 1997.
Allan D. Kraus et al., “Design and Analysis of Heat Sinks”, 1995 A Wiley-Interscience Publication, pp. 286-291.
Akash Jain et al., “Buoyancy-Driven Flow in Channels With In-Line Pin Fins” Proceedings of ASME NHTC'01, 35th National Heat Transfer Conference Anaheim, California, Jun. 10-12, 2001, pp. 1-8.
William K. Coxe III et al., “Experimental Modeling of the Passive Cooling Limit of Notebook Computers”, 2002 Inter Society Conference on Thermal Phenomena, pp. 15-21.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat dissipating structure for an electronic device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipating structure for an electronic device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating structure for an electronic device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3654833

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.