Heat-dissipating structure for an electrical device

Details Heat-dissipating structure for an electrical device Heat-dissipating structure for an electrical device

1999-04-05

2000-05-23

Picard, Leon P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361707, 361709, 361712, 361717, 361718, 361719, 257706, 257713, 257721, 174 163, 165 802, 165185, H05K 720

Patent

active

060672315

ABSTRACT:
A heat-dissipating structure for an electrical device comprises a PC board with a dissipating opening, and an electrical device. The PC board has an upper surface thereof and a lower surface thereof located opposite to the upper surface. The electrical device has a plurality of leads thereof extruding from a bottom surface thereof for anchoring the electrical device on the upper surface of the PC board with a substantial spacing in between. The dissipating opening is located under the electrical device for providing an air convection space to dissipate the heat generated by the electrical device. Also, dissipating plates can be installed above or under the PC board for enhancing the heat-dissipating efficiency.

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