Heat dissipating structure applicable to a computer host

Details Heat dissipating structure applicable to a computer host Heat dissipating structure applicable to a computer host

2007-11-06

2007-11-06

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C454S184000, C361S825000, C415S213100

Reexamination Certificate

active

11394976

ABSTRACT:
A heat dissipating structure for a computer host is disclosed. The heat dissipating structure is fixable to a housing of the computer host and is provided for a heat dissipating fan for dissipating heat. The heat dissipating structure includes a fan fixing housing including a front opening and a hollow network, the fan fixing housing being a hollow frame; a plurality of first fixing portions formed in a peripheral region around the front opening of the fan fixing housing; and a plurality of second fixing portions corresponding to the first fixing portions and formed on a peripheral region of the hollow network of the fan fixing housing.

REFERENCES:
patent: 6215659 (2001-04-01), Chen
patent: 6236564 (2001-05-01), Fan
patent: 6343011 (2002-01-01), Yu
patent: 6343014 (2002-01-01), Lin
patent: 6464578 (2002-10-01), Chin et al.
patent: 6616525 (2003-09-01), Giraldo et al.
patent: 6722971 (2004-04-01), Gough
patent: 6731502 (2004-05-01), Hsu
patent: 6817939 (2004-11-01), Gan et al.
patent: 6826048 (2004-11-01), Dean et al.
patent: 6930882 (2005-08-01), Broder et al.
patent: 7031157 (2006-04-01), Horng et al.
patent: 7156611 (2007-01-01), Oosawa et al.
patent: 7168912 (2007-01-01), Sun
patent: 2004/0004812 (2004-01-01), Curlee et al.
patent: 2004/0095723 (2004-05-01), Tsai et al.
patent: 2006/0104028 (2006-05-01), Patel et al.
patent: 2006/0210398 (2006-09-01), Lin
patent: 1247989 (2002-10-01), None
patent: 11068364 (1999-03-01), None
patent: 2002037877 (2002-05-01), None
patent: 2003069611 (2003-08-01), None
patent: 2005109175 (2005-11-01), None
patent: 2006030727 (2006-04-01), None
patent: WO 9304289 (1993-03-01), None

Affiliated with

Also associated with

Rating

Heat dissipating structure applicable to a computer host does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipating structure applicable to a computer host, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating structure applicable to a computer host will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3807626