Heat dissipating structure and its manufacturing method

Details Heat dissipating structure and its manufacturing method Heat dissipating structure and its manufacturing method

2000-04-17

2001-07-24

Flanigan, Allen (Department: 3743)

Heat exchange

With retainer for removable article

Electrical component

C029S890030

Reexamination Certificate

active

06263956

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat dissipating structure and its manufacturing method. In accordance with the present invention, the heat transfer capacity of the heat dissipating structure is increased.
2. Description of the Prior Art
Referring to
FIG. 1
, there is shown a conventional heat dissipating structure made of extruded aluminum. It includes a heat dissipating base
11
and a plurality of heat dissipating fins
12
extending upwardly therefrom. The heat dissipating base
11
and these heat dissipating fins
12
are integrally formed. However, because of limitations inherent to the extruded aluminum mold, the ratio of the fin's height to width cannot be too large. Each fin cannot be very thin; and, the fins' distribution is quite limited. Therefore, some designs of fins cannot be realized. Given the development of electronic elements with high working rates, a new technology is needed to overcome the disadvantages of the conventional heat dissipating fins made of extruded aluminum.
SUMMARY OF THE INVENTION
The primary object of the present invention is to provide a heat dissipating structure having increased heat transfer capacity. Particularly, an object is to improve the ratio of the fin's height to width, so as to increase the effective heat transfer area, and enhance the cooling capacity.
The other object of the present invention is to provide a manufacturing method for the heat dissipating structure that is simple and may be carried out without special machines.


REFERENCES:
patent: 5533257 (1996-07-01), Romero et al.
patent: 5542176 (1996-08-01), Serizawa et al.
patent: 5771966 (1998-06-01), Jacoby
patent: 5819407 (1998-10-01), Terada
patent: 5903977 (1999-05-01), Fisher et al.
patent: 6098279 (1998-11-01), Lee

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