Solid anti-friction devices – materials therefor – lubricant or se – Lubricants or separants for moving solid surfaces and... – Graphite – coal – or elemental carbon
Reexamination Certificate
2003-04-09
2004-11-16
McAvoy, Ellen M. (Department: 1764)
Solid anti-friction devices, materials therefor, lubricant or se
Lubricants or separants for moving solid surfaces and...
Graphite, coal, or elemental carbon
C508S150000, C508S155000, C508S161000, C508S172000, C508S173000, C508S208000
Reexamination Certificate
active
06818600
ABSTRACT:
FIELD OF THE INVENTION
This invention relates to a heat-dissipating grease composition, and more specifically, to a heat-dissipating silicone grease composition suitable for use over a long period of time.
BACKGROUND OF THE INVENTION
Heat-dissipating silicone greases based on silicone grease and containing various kinds of powders as fillers, are known in the prior art (Tokko Sho 52-33272, Tokko Sho 59-52195, Tokkai Sho 52-125506, Tokkai Sho 57-36302, Tokkai Sho 62-43492, Tokkai Hei 2-212556 and Tokkai Hei 3-162493 (Koho)).
However, when used over a long period of time, the base oils in these silicone greases sometimes bled so that their heat-dissipating properties declined, or led to poor connections in electrical contacts.
As a result of intensive studies aimed at solving the above problem, the inventors found that the exudation of base oil could be suppressed by using a specific organopolysiloxane as the base oil, and thereby arrived at this invention.
It is therefore an object of this invention to provide a highly reliable silicone grease composition for heat dissipation having stable thermoconductive properties over a long period of time, which does not exude oil, and which does not lead to contact defects.
SUMMARY OF THE INVENTION
The above object is attained by a heat-dissipating silicone grease composition comprising:
(A) 100 weight parts of an organopolysiloxane having a thixotropicity degree &agr; of 1.03-1.50 and a viscosity at 25° C. of 100-1,000,000mm
2
/s, and
(B) 100-2,000 weight parts of a thermally conductive inorganic filler having an average particle diameter of 0.1-100 micrometers.
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Japanese Patent Abstract No. JP 02 097560, dated Apr. 10, 1990.
Uchida Osamu
Yamada Kunihiro
McAvoy Ellen M.
Millen White Zelano & Branigan P.C.
Shin-Etsu Chemical Co. , Ltd.
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