Heat dissipating RF electronics housing

Details Heat dissipating RF electronics housing Heat dissipating RF electronics housing

2002-01-07

2003-03-04

Gandy, James (Department: 2912)

Equipment for production, distribution, or transformation of ene

Casing or enclosure not elsewhere specified

Design Patent

active

D0471168

CLAIM:
The ornamental design for a heat dissipating RF electronics housing, as shown and described.

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HyperLink Technologies, Inc., “HyperAmp™ HA2401A,” Jan. 20, 2001, Web Article: www.hyperlinktech.com/html/products/ha2401a.html.
Young Design, Inc., “AMP 2440,” Jan. 20, 2001, Web Article: www.ydi.com/Products/Amplifiers/AMP2440/amp2440.html.

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