Heat-dissipating module for an electronic device

Details Heat-dissipating module for an electronic device Heat-dissipating module for an electronic device

2000-01-31

2000-12-26

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361695, 361703, 361704, 361717, 361718, 174 161, 174 163, 165 803, 16510434, 16510433, H05K 720

Patent

active

061669067

ABSTRACT:
A heat-dissipating module for dissipating heat generated by an electronic component includes a fan base formed with a fan mounting cavity, a heat-dissipating fan mounted in the fan mounting cavity, a heat-conducting plate adapted to contact a heat-dissipating side of the electronic component, and a connecting shaft having a mounting section that is mounted on the heat-conducting plate and a pivot section that extends from the mounting section and that is mounted pivotally on the fan base, thereby permitting movement of the heat-conducting plate toward and away from the heat-dissipating side of the electronic component.

REFERENCES:
patent: 5598320 (1997-01-01), Toedtman et al.
patent: 5764482 (1998-06-01), Meyer, IV et al.
patent: 5781409 (1998-07-01), Mercedy, III
patent: 5841633 (1998-11-01), Huang
patent: 5875095 (1999-02-01), Webb
patent: 5940269 (1999-08-01), Ko et al.
patent: 5960865 (1999-10-01), Costa et al.
patent: 5963424 (1999-10-01), Hileman et al.
patent: 6047765 (2000-04-01), Zhan

Affiliated with

Also associated with

Rating

Heat-dissipating module for an electronic device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-dissipating module for an electronic device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-dissipating module for an electronic device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1001921