Heat dissipating module for a heat generating electronic compone

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

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Details

361707, 361709, 361710, 361719, 165 803, 165185, 174 163, 257706, 257707, 257718, 257719, 257727, H05K 720

Patent

active

060551593

ABSTRACT:
A heat dissipating module is adapted for use with an electronic component on one side of a circuit board, and includes a heat sink having a contacting portion to be brought into contact with the electronic component, and a peripheral portion around the contacting portion and formed with a plurality of sink fastener holes that correspond respectively to board fastener holes formed in the circuit board around the electronic component. A back plate is to be disposed adjacent to the other side of the circuit board opposite to the electronic component, and is formed with a plurality of anchoring members that extend through the circuit board via the board fastener holes. Each of a plurality of spring-loaded fasteners has a shank portion, a curved hook portion that extends from the bottom end of the shank portion, and an operating portion that extends transversely from the top end of the shank portion. The shank portion of each fastener extends through a respective sink fastener hole, and the hook portion of each fastener extends through an anchor groove formed in a respective anchoring member for hooking thereon. Each fastener further has a biasing member for urging the heat sink to contact tightly the electronic component, and for ensuring tight engagement between the hook portion and the respective anchoring member.

REFERENCES:
patent: 5302853 (1994-04-01), Volz et al.
patent: 5754400 (1998-05-01), Sathe et al.
patent: 5870286 (1999-02-01), Butterbaugh et al.
patent: 5901039 (1999-05-01), Dehaine et al.
patent: 5978223 (1999-11-01), Hamilton et al.

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