Heat exchange – Intermediate fluent heat exchange material receiving and... – Including means to move gaseous heat exchange material
Reexamination Certificate
2007-11-08
2011-11-08
Duong, Tho V (Department: 3744)
Heat exchange
Intermediate fluent heat exchange material receiving and...
Including means to move gaseous heat exchange material
C165S077000
Reexamination Certificate
active
08051899
ABSTRACT:
A heat dissipating module includes a fan and a heat sink. The heat sink comprises a body and at least one movable member. The body comprises a plurality of fins, at least one first slot and at least one second slot. The first and second slots are integrally formed on the body as a single piece. The movable member, rotatably or movably coupled to the first slot, comprises a pivoting portion, an operating portion, a jointing portion and at least one fixing portion. The pivoting portion is rotatably or movably received in the first slot. A first end of the operating portion connects to the pivoting portion, rotating or moving the pivoting portion. The jointing portion, at a second end of the operating portion, selectively connects to or separates from the second slot. The fixing portion protrudes from the pivoting portion, abutting and securing the fan to the heat sink.
REFERENCES:
patent: 6435467 (2002-08-01), Lai
patent: 2004/0000398 (2004-01-01), Lee et al.
patent: 2005/0117306 (2005-06-01), Lee et al.
patent: 2006/0056152 (2006-03-01), Li et al.
patent: 02271720 (2003-07-01), None
patent: 2003030350 (2003-04-01), None
patent: 267523 (2005-06-01), None
Chen Chin-Ming
Huang Yu-Hung
Lin Yu-Hsien
Birch & Stewart Kolasch & Birch, LLP
Delta Electronics , Inc.
Duong Tho V
LandOfFree
Heat dissipating module and heat sink thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipating module and heat sink thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating module and heat sink thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4275098