Heat-dissipating module and electronic device having the same

Details Heat-dissipating module and electronic device having the same Heat-dissipating module and electronic device having the same

2009-04-02

2010-11-30

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C361S719000, C165S080400, C165S104330, C257S715000, C174S015100

Reexamination Certificate

active

07843694

ABSTRACT:
An electronic device having a heat-dissipating module includes a housing and an electronic component (e.g., a central processing unit) disposed within the housing. The heat-dissipating module is used for dissipating heat of the electronic component, and includes a two-phase flow heat-dissipating loop and a thermoelectric cooling component. The two-phase flow heat-dissipating loop can be a loop heat pipe (LHP) or a capillary pumped loop (CPL). The thermoelectric cooling component includes a cooling portion and a heat-generating portion respectively to cool or heat necessary portions of the two-phase flow heat-dissipating loop, or directly cool the electronic component through the cooling portion, thereby increasing the heat-dissipation effect of the two-phase flow heat-dissipating loop.

REFERENCES:
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patent: 6525934 (2003-02-01), Nakanishi et al.
patent: 6705089 (2004-03-01), Chu et al.
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patent: 7548427 (2009-06-01), Mongia
patent: 2006/0185826 (2006-08-01), Ohashi
patent: 2007/0034356 (2007-02-01), Kenny et al.

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