Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2009-03-10
2010-11-16
Vortman, Anatoly (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S700000, C361S709000, C361S711000, C361S702000, C361S719000, C361S679520, C361S679540, C165S080200, C165S080300
Reexamination Certificate
active
07835152
ABSTRACT:
A heat dissipating module includes a heat dissipating unit, a heat collecting plate with a position limiting hole, a heat conducting member connected between the heat dissipating element and the heat collecting plate, and a fixing structure. The fixing structure includes two end portions, an arcuate elastic portion, and a position limiting portion connected to the arcuate elastic portion and extending through the position limiting hole. Each end portion is slidably disposed on the heat collecting plate. The arcuate elastic portion is connected between the two end portions and adapted to be fastened to the heat collecting plate and a base, such that an electrical component is sandwiched in between the heat collecting plate and the base.
REFERENCES:
patent: 5339214 (1994-08-01), Nelson
patent: 5398748 (1995-03-01), Yamaji et al.
patent: 5549155 (1996-08-01), Meyer et al.
patent: 6140571 (2000-10-01), Kitahara et al.
patent: 6226178 (2001-05-01), Broder et al.
patent: 6347036 (2002-02-01), Yeager et al.
patent: 6373700 (2002-04-01), Wang
patent: 6469894 (2002-10-01), Ubukata
patent: 6625021 (2003-09-01), Lofland et al.
patent: 6650540 (2003-11-01), Ishikawa
patent: 6781835 (2004-08-01), Hashimoto et al.
patent: 6883594 (2005-04-01), Sarraf et al.
patent: 6900990 (2005-05-01), Tomioka
patent: 6966363 (2005-11-01), Gailus et al.
patent: 7215548 (2007-05-01), Wu et al.
patent: 7327574 (2008-02-01), Frank et al.
patent: 7397667 (2008-07-01), Lin et al.
patent: 7400507 (2008-07-01), Wang et al.
patent: 7405933 (2008-07-01), Kobayashi et al.
patent: 7426112 (2008-09-01), Chi-Wei et al.
patent: 7477515 (2009-01-01), Tsai et al.
patent: 7489510 (2009-02-01), Hung et al.
patent: 7508669 (2009-03-01), Fonfara et al.
patent: 7515418 (2009-04-01), Straznicky et al.
patent: 7542293 (2009-06-01), Zhao et al.
patent: 7639503 (2009-12-01), Tanaka
patent: 7701708 (2010-04-01), Wu et al.
patent: 2002/0126453 (2002-09-01), Ubukata
patent: 2003/0024688 (2003-02-01), Dowdy et al.
patent: 2003/0183373 (2003-10-01), Sarraf et al.
patent: 2004/0037045 (2004-02-01), Phillips et al.
patent: 2004/0042184 (2004-03-01), Tomioka
patent: 2004/0109301 (2004-06-01), Shih-Tsung
patent: 2004/0123978 (2004-07-01), Hashimoto et al.
patent: 2004/0165350 (2004-08-01), Fan
patent: 2004/0188080 (2004-09-01), Gailus et al.
patent: 2004/0201958 (2004-10-01), Lev
patent: 2004/0257770 (2004-12-01), Hu
patent: 2005/0099776 (2005-05-01), Xue et al.
patent: 2005/0141202 (2005-06-01), Lee et al.
patent: 2005/0180110 (2005-08-01), I-Yung et al.
patent: 2005/0259405 (2005-11-01), He
patent: 2006/0181850 (2006-08-01), Frank et al.
patent: 2006/0232934 (2006-10-01), Kusamoto et al.
patent: 2293446 (1996-03-01), None
patent: 09191440 (1997-07-01), None
Chen Chiun-Peng
Chung Chih-Kuang
Huang Ting-Chiang
Syu Sheng-Jie
Wang Li-Ting
Inventec C'orporation
J.C. Patents
Vortman Anatoly
LandOfFree
Heat dissipating module does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipating module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating module will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4204859