Heat dissipating module

Details Heat dissipating module Heat dissipating module

2007-02-13

2008-09-16

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C361S704000, C361S719000, C257S715000, C257S718000, C257S719000, C257S727000, C174S015200, C165S080400, C165S104260

Reexamination Certificate

active

07426112

ABSTRACT:
A heat dissipating module includes a releasing member, a heat pipe, which has a first end connected to the releasing member and a second end attached to the top surface of a thermal chip on a circuit board, and a fastening member, which has a protruded arch portion that defines an arch chamber that accommodates the second end of the heat pipe, two press portions respectively extended from two opposite lateral sides of the protruded arch portion and pressed on the top surface of the thermal chip, and a plurality of hook portions respectively extended from the press portions and hooked on the bottom edge of the circuit board.

REFERENCES:
patent: 6301107 (2001-10-01), Lev et al.
patent: 6469893 (2002-10-01), Frutschy et al.
patent: 6781835 (2004-08-01), Hashimoto et al.
patent: 7327574 (2008-02-01), Frank et al.
patent: 2003/0106670 (2003-06-01), Lee et al.
patent: 2003/0117773 (2003-06-01), Cheng et al.
patent: 2004/0001316 (2004-01-01), Kamikawa et al.

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