Heat-dissipating model

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S104260, C165S104330, C362S294000

Reexamination Certificate

active

07610947

ABSTRACT:
A heat-dissipating model includes a heat-conducting member and a heat-dissipating body. The heat-conducting member has a hollow cylinder with a closed end. The interior of the wall of the cylinder is formed with a vacuum chamber. The vacuum chamber is provided with a capillary structure and a working fluid therein. The heat-dissipating body has a through hole for connecting to the outer periphery of the heat-conducting member. Further, the periphery of the heat-dissipating body is provided with a plurality of heat-dissipating fins. With the above arrangement, the heat generated by the heat source can be dissipated to a far place, so that it can be continuously operated at a lower temperature. As a result, the effect of heat conduction or dissipation can be improved and the life is extended.

REFERENCES:
patent: 2901654 (1959-08-01), Myers
patent: 3658125 (1972-04-01), Freggens
patent: 3714981 (1973-02-01), Noren
patent: 3791372 (1974-02-01), Hatsopoulos et al.
patent: 4633371 (1986-12-01), Nagy et al.
patent: 5561338 (1996-10-01), Roberts et al.
patent: 6802363 (2004-10-01), Wang
patent: 7051794 (2006-05-01), Luo
patent: 7210832 (2007-05-01), Huang
patent: 7269013 (2007-09-01), Chen et al.
patent: 2002/0080582 (2002-06-01), Chang
patent: 2003/0066628 (2003-04-01), Mochizuki et al.
patent: 2004/0108104 (2004-06-01), Luo
patent: 2004/0120148 (2004-06-01), Morris et al.
patent: 2005/0041428 (2005-02-01), Zhang
patent: 2005/0111234 (2005-05-01), Martin et al.
patent: 2005/0169006 (2005-08-01), Wang et al.
patent: 2006/0193139 (2006-08-01), Sun et al.
patent: 2006/0290891 (2006-12-01), Wang et al.
patent: 2008/0298066 (2008-12-01), Van De Voorde et al.
patent: 1487322 (1977-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat-dissipating model does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-dissipating model, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-dissipating model will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4082549

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.