Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-09-19
2006-09-19
Cuneo, Kamand (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S720000, C361S721000, C361S719000, C174S015100
Reexamination Certificate
active
07110258
ABSTRACT:
A heat dissipating microdevice includes a board, a fluid microsystem, and a coolant. The board includes an insulator layer that has first and second surfaces, a conductor layer formed on the first surface, and a cover member disposed on the second surface. The fluid microsystem is formed in the insulator layer of the board, and includes first and second micro-channel structures, and first and second micro-conduit structures that permit fluid communication between the first and second micro-channel structures. The coolant is contained in the fluid microsystem, and flows from the second micro-channel structure to the first micro-channel structure through the first micro-conduit structure, and from the first micro-channel structure back to the second micro-channel structure through the second micro-conduit structure.
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Ding Pei-Pei
Lee Chang-Chi
Lin Jao-Ching
Asia Vital Components Co. Ltd.
Cuneo Kamand
Lowe Hauptman & Berner LLP
Nguyen Hoa C.
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