Heat dissipating light emitting diode module having fastened...

Illumination – Housing – With cooling means

Reexamination Certificate

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C361S801000, C439S056000, C165S104260, C165S104330, C362S800000

Reexamination Certificate

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07540636

ABSTRACT:
An LED module includes a housing component, a frame holding an LED thereon and covered by the housing component, a fastener located in and secured to the housing component, a heat spreader located in the fastener and secured to the fastener and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The housing component tightly presses the frame on the fastener to make a close contact between the heat pipe and the frame. The heat pipe transfers heat from the LED to the heat spreader and the heat-dissipating unit. The heat spreader and the heat-dissipating unit each have a large heat-dissipating surface, whereby the heat generated by the LED can be quickly dissipated by the heat spreader and the heat-dissipating unit.

REFERENCES:
patent: 6517221 (2003-02-01), Xie
patent: 7144140 (2006-12-01), Sun et al.
patent: 2007/0041220 (2007-02-01), Lynch
patent: 2007/0201232 (2007-08-01), Chen
patent: 2007/0285926 (2007-12-01), Maxik
patent: 2005317480 (2005-11-01), None
patent: M294005 (2006-07-01), None
English Abstract of Japanese Publication JP 2005317480 A.

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