Heat dissipating lid hinge structure with laterally offset heat

Details Heat dissipating lid hinge structure with laterally offset heat Heat dissipating lid hinge structure with laterally offset heat

1996-12-19

1998-07-14

Phillips, Michael W.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

16223, 16342, 361700, 16510433, 174 152, G06F 120, H05K 720, F28D 1502

Patent

active

057814090

ABSTRACT:
A notebook computer display housing is pivotally connected to its associated CPU housing by a heat dissipating hinge structure having telescoped, relatively rotatable first and second sections respectively anchored to the CPU and display housings. The heat absorbing evaporation end of a first thermosyphoning heat pipe is conductively connected to a heat generating electronic component within the CPU housing, with the heat rejecting condensing end of the heat pipe defining the first hinge structure section. During computer operation, heat from the electronic component is sequentially transferred through the heat pipe and the second hinge structure section, in which the first hinge section is journaled, to the display housing for dissipation therefrom to ambient. Heat transfer from the second hinge structure section to the display housing is representatively facilitated by a second thermosyphoning heat pipe having an evaporator end received in an opening in the second hinge structure section, and laterally offset from the condensing end of the first heat pipe, and a condensing end thermally communicated with the display housing.

REFERENCES:
patent: 5313362 (1994-05-01), Hatada et al.
patent: 5383340 (1995-01-01), Larson et al.
patent: 5588483 (1996-12-01), Ishida
patent: 5621613 (1997-04-01), Haley et al.
patent: 5646822 (1997-07-01), Bhatia et al.

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