Heat dissipating interconnect tape for use in tape automated bon

Details Heat dissipating interconnect tape for use in tape automated bon Heat dissipating interconnect tape for use in tape automated bon

1987-12-18

1989-05-02

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361421, 29827, 206330, 428573, H05K 720

Patent

active

048273767

ABSTRACT:
The present invention is directed to electronic packages. A heat dissipating pad positioned over the electrically active face of an electronic device transfers heat from the device to the electronic package or to an external heat sink. A dielectric electrically isolates the heat dissipating pad from the electronic device.

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patent: 4684975 (1987-08-01), Takiar et al.
patent: 4704187 (1987-11-01), Fujita
"TAB Technology Tackles High Density Interconnections" by Tom Dixon, Electronic Packaging & Production, Dec. 1984, pp. 34-39.
"Future Packages' Heat Transfer Will Affect PCB Designs" by Ernel R. Winkler, Electronic Packaging & Production, Apr. 1985, pp. 104-109.
"Advanced Packaging for VLSI" by Charles J. Bartlett, Solid State Technology, Jun. 1986, pp. 119-123.
"Microelectronic Packaging" by Albert J. Blodgett, Jr., Scientific America, Jul. 1983, pp. 86-96.

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