Heat dissipating housing for an electronic component

Details Heat dissipating housing for an electronic component Heat dissipating housing for an electronic component

1986-08-25

1988-08-09

Envall, Jr., Roy N.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361389, H02B 100, H05K 720

Patent

active

047632259

ABSTRACT:
A heat dissipating housing (1, 4, 5, 6) with a tub (1, 4) and an outer cover (5, 6) seated on the tub (1, 4)--preferably hermetically tight--for an electronic circuit component (11, 17) which in operation gives off heat to be dissipated such as a light emitting diode (17) and/or a semiconductor driver chip (11) is disclosed. The circuit component (11, 17) is fastened on the bottom (1) of the tub (1, 4). In operation, the heat to be dissipated is to be transferred at least in considerable part via a heat removal body (5, 6) of the housing (1, 4, 5, 6) to an outer surface of the housing, preferably via a heat conducting outer cover (5, 6) serving as the heat removal body (5, 6) to the outer surface air, sweeping the housing. The dissipated heat removal to the cooling medium is improved by especially simple means in that at least a part of the inner surface of the bottom (1) as well as of the sidewalls (4) of the--on the whole--relatively poorly heat conducting tub (1, 4) is lined with at least one lining sheet (2) of good heat conduction, the lining sheet (2) having a transitional section of good heat conduction toward the circuit component (11, 17) as well as toward the heat removal body (5, 6).

REFERENCES:
patent: 3328642 (1967-06-01), Haumesser et al.
patent: 4394679 (1983-06-01), Hawrylo
patent: 4415025 (1983-11-01), Horvath
patent: 4612601 (1986-09-01), Watari
IBM Bulletin, Kunkler et al., vol. 23, No. 9, Feb. 1981; pp. 4095-4096.
IBM Bulletin, Shott; vol. 20, No. 7, Dec., 1977; pp. 1635-2636.

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