Heat dissipating housing for a circuit component

Details Heat dissipating housing for a circuit component Heat dissipating housing for a circuit component

1986-08-25

1988-12-20

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361388, 357 79, H05K 720

Patent

active

047928786

ABSTRACT:
A heat dissipating housing (W/Gl/G) for a circuit component (IC) consists of at least one bottom tub (G) and a cover (W) having a planar cover face. A frame-shaped portion of this cover face serves as a bearing surface (TF) for meeting a planar bearing surface (TF) of the sidewalls (G1) of the bottom tub (G). Both bearing surfaces (TF) are finally fastened together. At least parts of the cover's outside surface (W) are cooled in operation by a cooling medium (KL), dissipated heat being conveyed from the circuit component (IC) via a stiff heat conducting body (SC1, SC2) and a good heat conductor element consisting of elastic material (FE/WS/WL) to the cover (W). In each instance, at least one good heat conductor spring structure (WL/WS) with feather tongues (WL) is inserted in lateral gaps between the heat conducting body (SC1, SC2) and at least two of the sidewalls (G1) of the bottom tub (G) in an expanding manner by means of its feather tongues (WL) so that these spring structures (WL/WS) adhere through friction forces. The element (FE) and the spring structures (WS/WL) are formed as a cohering spring unit (Fe/WL/WS) from a single piece of spring plate with a center part (FE) and side parts (WS). The good heat conductor cover (W) is connected with the center part (FE) firmly and heat conductingly. Centering retention of cover (w) by the spring unit inhibits displacement of cover (w) relative to the sidewalls.

REFERENCES:
patent: 3826953 (1974-07-01), LeGaler
patent: 4008487 (1977-02-01), Vogt
patent: 4246597 (1981-01-01), Cole et al.
patent: 4415025 (1983-11-01), Horvath
patent: 4451540 (1984-05-01), Baird et al.
patent: 4524238 (1985-06-01), Butt
patent: 4546028 (1985-10-01), Val
IBMTDB, Eckenbach et al, "Semiconductor Module with Heat Transfer", vol. 20, No. 12, May 1978.
IBMTDB, "New Coating for Radial Finger Cooling", vol. 28, No. 12, May 1986.

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