Heat dissipating fan/integrated circuit assemblies

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

165122, 165185, 257719, H05K 720

Patent

active

058285504

ABSTRACT:
A heat dissipating fan/integrated circuit assembly includes a connector mounted on a printed circuit board and having two protrusions respectively projecting outwardly from two opposite sides thereof, an integrated circuit securely mounted to an upper side of the connector thereof, a fin mounted to an upper side of the integrated circuit, a fan device mounted on top of the fin and including two slots defined therein, and two engaging members respectively extending through the associated slots. Each engaging member includes an engaging hole defined in a lower end thereof for releasably engaging with the associated protrusion of the connector. An elastic member is mounted between each engaging member and the fan device to bias the associated engaging member away from the fan device, thereby providing a secure engagement between each protrusion and the associated engaging hole.

REFERENCES:
patent: 5287249 (1994-02-01), Chen
patent: 5299632 (1994-04-01), Lee
patent: 5309983 (1994-05-01), Bailey
patent: 5335722 (1994-08-01), Wu
patent: 5368094 (1994-11-01), Hung
patent: 5409352 (1995-04-01), Lin
patent: 5421402 (1995-06-01), Lin
patent: 5495392 (1996-02-01), Shen
patent: 5664624 (1997-09-01), Tsai et al.
patent: 5678627 (1997-10-01), Lee
patent: 5708564 (1998-01-01), Lin
Taiwan Office Action dated Jan. 3, 1998 for Taiwan Application No. 86202949 referencing Taiwan Patent No. 322,966 dated Dec. 11, 1997.

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