Heat dissipating enclosure for electronic components

Details Heat dissipating enclosure for electronic components Heat dissipating enclosure for electronic components

1997-05-30

2000-05-23

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361690, 361688, 361689, 174 161, 174 163, 165 803, 165185, H05K 720

Patent

active

060672293

ABSTRACT:
A device for housing electronic components that produce heat and must be cooled. The device includes a housing having at least one vertical wall that has an interior surface and a corresponding exterior surface. Rows of vains are disposed on the interior surface of the wall. Each row of vains contains a plurality of parallel vains having the same general dimensions. Adjacent rows of vains are not aligned. As a result, the vains on one internal row do not lay in the same line as vains from adjacent internal rows. External vains are disposed on the exterior surface of the wall, opposite the internal vains. The external vains correspond in position and number with the internal vains. Heat absorbed by the internal vains is transferred to the external vains by conduction, wherein the external vains dissipate the absorbed heat to the surrounding environment with an efficiency that is made possible by the configuration of the vains.

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