Heat dissipating device with heat pipe

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

Reexamination Certificate

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Details

C165S104210, C165S080400, C361S697000, C361S704000, C361S700000, C257S715000, C174S015200

Reexamination Certificate

active

07025125

ABSTRACT:
A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base (10), a plurality of heat-dissipating fins (30) and at least one heat pipe (20). The base defines at least a groove (13) thereon. The heat pipe comprises an evaporating portion (22) received in the groove and a condensing portion (21) extending through the fins. The evaporating portion of the heat pipe is curved so as to increase contact surface between the evaporating portion and the base. The condensing portion of the heat pipe extends perpendicularly away from the base.

REFERENCES:
patent: 5651414 (1997-07-01), Suzuki et al.
patent: 5697428 (1997-12-01), Akachi
patent: 6102110 (2000-08-01), Julien et al.
patent: 6167619 (2001-01-01), Beagle
patent: 6189601 (2001-02-01), Goodman et al.
patent: 6394175 (2002-05-01), Chen et al.
patent: 6625021 (2003-09-01), Lofland et al.
patent: 2003/0000689 (2003-01-01), Kuo et al.
patent: 2003/0024687 (2003-02-01), Cheng et al.
patent: 2004/0035558 (2004-02-01), Todd et al.
patent: 00210761.9 (2000-12-01), None
patent: 496133 (2002-07-01), None

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