Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-12-27
2003-02-25
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C024S458000, C165S080300, C165S121000, C257S727000, C248S510000, C361S710000, C361S719000
Reexamination Certificate
active
06525941
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a heat dissipating device, more particularly to a heat dissipating device which includes a pressing member that is rotatable to urge a fin module toward a circuit board.
2. Description of the Related Art
FIG. 1
illustrates a conventional heat dissipating device for dissipating heat generated by an electronic component
63
, such as a central processing unit, that is mounted on a circuit board
64
. The conventional heat dissipating device includes a base frame
65
mounted on the circuit board
64
, a heat-dissipating fin module
62
disposed in the base frame
65
, and a fan module
6
mounted on the base frame
65
and disposed above the fin module
62
. The base frame
65
has a bottom part formed with a through hole
653
that is registered with the electronic component
63
so as to allow the electronic component
63
to extend thereinto when the base frame
65
is mounted on the circuit board
64
, and opposite flange members
651
extending respectively and upwardly from sides of the bottom part that are opposite in a first direction. Each of the flange members
651
is formed with a pair of engaging holes
652
that are spaced apart from each other in a second direction transverse to the first direction. The fin module
62
is disposed on the bottom part and is in heat-conductive contact with the electronic component
63
. The fin module
62
has a plurality of parallel fin plates
620
. The fan module
6
includes a positioning seat
66
disposed above the fin plates
620
, a fan
61
mounted on the positioning seat
66
, and parallel positioning members
67
. The positioning seat
66
has opposite downwardly extending side walls
661
for positioning the fin plates
620
therebetween, and a pair of upwardly opening positioning grooves
662
that are spaced apart from each other in a second direction. The positioning seat
66
is formed with a through hole
663
so as to allow air currents from the fan
61
to reach the fin plates
620
. Each of the positioning members
67
has a positioning piece
671
, an engaging piece
672
opposite to the positioning piece
671
, and a downwardly extending intermediate positioning block
673
that is disposed in a respective one of the positioning grooves
662
of the positioning seat
66
. When the fan module
6
is assembled onto the base frame
65
, first, the positioning piece
671
of each of the positioning members
67
engages a respective one of the engaging holes
652
in one of the flange members
651
, and the engaging piece
672
of each of the positioning member
67
is then pressed downwardly to engage a respective one of the engaging holes
652
in the other one of the flange members
651
.
However, when the positioning pieces
671
of the positioning members
67
do not engage the engaging holes
652
in one of the flange members
651
at the same time, a pressure difference is formed at one side of the fin module
62
so as to result in tilting of the same. As such, different pressures applied by the positioning members
67
may result in damage to the electronic component
63
and have an adverse affect on the mounting efficiency.
SUMMARY OF THE INVENTION
Therefore, the object of the present invention is to provide a heat dissipating device with a heat-dissipating fin module that can be mounted easily and evenly on a circuit board.
According to the present invention, a heat dissipating device is adapted to a circuit board for dissipating heat produced by an electronic circuit board, and comprises:
a base frame adapted to be mounted on the circuit board and including a bottom part with first and second sides opposite to each other in a first direction, each of the first and second sides having first and second flange members that extend upwardly from the respective side and, each flange is formed with a respective engaging hole spaced apart from the other engaging hole in a second direction transverse to the first direction, the bottom part being formed with a through hole that is registered with the electronic component so as to allow the electronic component to extend thereinto when the base frame is mounted on the circuit board;
a heat-dissipating fin module disposed in the base frame on the bottom part and adapted to be in heat-conductive contact with the electronic component, that fin module having a plurality of parallel fin plates, adjacent ones of the fin plates being spaced apart from each other; and
a fan module mounted on the base frame and disposed above the fin module, the fan module including
a fan for inducing air currents between each adjacent pair of the fin plates,
parallel positioning members connected to the fan and spaced apart from each other in the second direction, each of the positioning members having a positioning end portion, a coupling end portion opposite to the positioning end portion, and an intermediate abutting portion disposed between the positioning and coupling end portions and extending in the first direction above the fin module, the positioning end portion being formed with a positioning piece that engages a respective one of the engaging holes in one flange member on the first side of the bottom part of the base frame, and
an operating member extending in the second direction and coupled pivotally to the coupling end portions of the positioning members, the operating member having opposite engaging end portions and an intermediate pressing portion between the engaging end portions, the pressing portion being operable so as to rotate the engaging end portions relative to the fan from a disengaging position, where the engaging end portions disengage the engaging holes in the flange member on the second side of the bottom part of the base frame such that the abutting portions of the positioning members are relieved from applying pressure on the fin module, to an engaging position, where each engaging end portion engages a respective engaging hole in the flange member on the second side of the bottom part of the base frame such that the abutting portions of the positioning members are pulled toward and apply pressure on the fin module, thereby enabling the fin module to contact tightly the electronic component.
REFERENCES:
patent: 5943209 (1999-08-01), Liu
patent: 6049457 (2000-04-01), Lee
patent: 6332251 (2001-12-01), Ho et al.
patent: 6404633 (2002-06-01), Hsu
Tai-Sol Electronics Co., Ltd.
Thompson Gregory
LandOfFree
Heat dissipating device with a pressing member that is... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipating device with a pressing member that is..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating device with a pressing member that is... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3117509