Heat dissipating device incorporating clip

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C165S080300, C165S185000, C257S718000, C257S727000, C174S016300

Reexamination Certificate

active

07075790

ABSTRACT:
A heat dissipating device includes a heat sink (50) and two clips (10) for mounting the heat sink to a retention module (60) which surrounds an electronic component (65). The heat sink provides two shoulders (72). Each clip includes a strap (21) supported on one shoulder, a lever (40) having a cam pivotally connected to the strap, two legs (30) pivotally connected to opposite end portions of the strap, and two spring fingers (26) integrally extending from opposite ends of the strap. In assembly, the straps are downwardly pressed and the retention module push the legs to pivot away from the feet from original states toward forced states. When the legs arrive openings of the retention module the fingers urge the legs to enter the openings. The levers are then pivoted to push the straps to move upwardly to thereby cause the legs to firmly engage in the openings.

REFERENCES:
patent: 6061239 (2000-05-01), Blomquist
patent: 6082440 (2000-07-01), Clements et al.
patent: 6181559 (2001-01-01), Seo
patent: 6318452 (2001-11-01), Lee
patent: 6421242 (2002-07-01), Chen
patent: 6450248 (2002-09-01), Chang
patent: 6542367 (2003-04-01), Shia et al.
patent: 6643133 (2003-11-01), Liu
patent: 6731504 (2004-05-01), Liu
patent: 6978827 (2005-12-01), Armstrong
patent: 6988871 (2006-01-01), Deboer et al.

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