Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-08-14
2007-08-14
Gandhi, Jayprakash (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S690000, C361S692000, C361S695000, C174S015100
Reexamination Certificate
active
11265400
ABSTRACT:
A heat dissipating device (8) for cooling a number of electronic devices. The heat dissipating device includes a heat sink (7), a fan (6) mounted to a side of the heat sink and a fan duct (5). The heat sink includes a heat spreader (70), a cover (74) and fins (72) disposed between the heat spreader and the cover. The fan duct includes a mounting plate (50), a faceplate (52) extending downwardly from and perpendicular to the mounting plate, and baffle walls (506, 508) extending downwardly from the mounting plate. The mounting plate defines locating holes (540) for permitting screws (82) to pass through the locating holes and to engage with threaded holes (740) defined in the cover. An airflow generated by the fan flows through the fins and an outlet (524) defined between the baffle walls and the heat sink.
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Chen Chun-Chi
Deng Gen-Ping
Wu Yi-Qiang
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shenzhen) Co., Ltd.
Gandhi Jayprakash
Haughton Anthony M
Morris Manning & Martin LLP
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