Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-12-06
2005-12-06
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S717000, C361S718000, C361S720000, C174S252000, C165S080200, C165S185000
Reexamination Certificate
active
06972959
ABSTRACT:
A heat dissipation device is disclosed for dissipating the heat produced by electronic components (16) of an electronic control device. The electronic control device includes a circuit board (14), a resin protective case (10), and a metal actuator block (20). The electronic components are mounted on the circuit board. The protective case confines the circuit board within a thermally restrictive environment. The actuator block is mounted to the outside of the protective case. The heat dissipation device includes a heat conduction path (24, 30) that serves to thermally conduct the heat produced by the electronic components from the interior of the protective case to the actuator block.
REFERENCES:
patent: 5276584 (1994-01-01), Collins et al.
patent: 5467251 (1995-11-01), Katchmar
patent: 5590026 (1996-12-01), Warren et al.
patent: 5708566 (1998-01-01), Hunninghaus et al.
patent: 6044899 (2000-04-01), Langley et al.
patent: 6058013 (2000-05-01), Christopher et al.
patent: 6377462 (2002-04-01), Hajicek et al.
patent: 6600653 (2003-07-01), Koike et al.
patent: 6816377 (2004-11-01), Itabashi et al.
patent: 10-150283 (1998-06-01), None
Asai Nobuhiro
Saito Yoshitami
Advics Co., Ltd.
Buchanan & Ingersoll PC
Chervinsky Boris
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