Heat dissipating device for electronic component

Details Heat dissipating device for electronic component Heat dissipating device for electronic component

2007-12-04

2007-12-04

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S710000, C165S080300, C165S185000, C257S706000, C174S016300

Reexamination Certificate

active

11107039

ABSTRACT:
A heat dissipating device is used to be sandwiched between a motherboard and a chassis for transferring heat from the motherboard to the chassis. The heat dissipating device includes a body for contacting with a bottom side of the motherboard, and a plurality of wings extending from the body. Each wing includes a connecting section extending from the body and a contacting section extending further from the connecting section for contacting with the chassis. The body engages with the bottom side of the motherboard at a position corresponding to that a heat-generating electronic component is mounted to a top side of the motherboard. Heat generated by the electronic component is transferred to the chassis through the motherboard and the heat dissipating device. The heat dissipating device is formed by stamping a metal sheet with high heat conductivity.

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