Heat dissipating device for electronic component

Details Heat dissipating device for electronic component Heat dissipating device for electronic component

2005-10-25

2005-10-25

Vortman, Anatoly (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S696000, C361S702000, C361S703000, C361S697000, C361S710000, C257S722000, C257S706000

Reexamination Certificate

active

06958915

ABSTRACT:
A heat dissipating device includes a retention module (20) around an electronic component (15), a heat sink (30) attached to the retention module, and a fan (90). The heat sink includes a plurality of fins (62, 64, 66, 68) and spacers (52) interleaved between the fins, two heat pipes (80) sequentially extending through lower portions of the fins, the spacers and upper portions of the fins to bond the fins and the spacers together. Each spacer includes a flat bottom face for contacting the electronic component, and an arcuate top face. The fins includes two outer fins, and a plurality of inner fins each defining a cutout (62a,64a) cooperatively defining a chamber between the outer fins. The chamber and the arcuate spacers facilitate cooling air from the fan to blow to opposite sides of the heat sink thereby improving heat dissipation efficiency of the heat sink.

REFERENCES:
patent: 4291752 (1981-09-01), Bridgnell
patent: 4291754 (1981-09-01), Morse et al.
patent: 5020586 (1991-06-01), Mansingh
patent: 5509465 (1996-04-01), Lai
patent: 5593012 (1997-01-01), Aho
patent: 5654587 (1997-08-01), Schneider et al.
patent: 5699853 (1997-12-01), Goth et al.
patent: 5912802 (1999-06-01), Nelson
patent: 5946190 (1999-08-01), Patel et al.
patent: 5959837 (1999-09-01), Yu
patent: 6034430 (2000-03-01), Hamburgen et al.
patent: 6062301 (2000-05-01), Lu
patent: 6076594 (2000-06-01), Kuo
patent: 6189601 (2001-02-01), Goodman et al.
patent: 6289975 (2001-09-01), Kuo
patent: 6352104 (2002-03-01), Mok
patent: 6404632 (2002-06-01), Forkas
patent: 6450250 (2002-09-01), Guerrero
patent: 6651734 (2003-11-01), Liu
patent: 6827136 (2004-12-01), Liu
patent: 6842342 (2005-01-01), Lin
patent: 6883592 (2005-04-01), Lee
patent: 2002/0043360 (2002-04-01), Lee
patent: 2002/0121358 (2002-09-01), Lee
patent: 2004/0066628 (2004-04-01), Liu
patent: 3635901 (1988-04-01), None
patent: 443716 (2001-06-01), None
patent: 524433 (2003-03-01), None
patent: WO 00/27177 (2000-05-01), None

Affiliated with

Also associated with

Rating

Heat dissipating device for electronic component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipating device for electronic component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating device for electronic component will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3467266