Heat dissipating device for central processing units

Details Heat dissipating device for central processing units Heat dissipating device for central processing units

1996-07-18

1998-11-03

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361697, 361710, 257706, 257707, 257718, 257719, 165 803, 24458, H05K 720

Patent

active

058318291

ABSTRACT:
A heat dissipating device for CPUs includes a dissipating device mounted on a CPU and having a transverse groove near either lateral positioning end, the transverse groove having a depth greater than a groove between every two adjacent dissipating plates of the dissipating device. A first positioning strip is bent to have a substantially vertical portion having a hook end for engaging a securing substrate of the CPU and a substantially horizontal portion having a slanting portion with a tongue for engaging one of the transverse grooves. A second positioning strip also has a slanting portion with a tongue for engaging the other of the transverse grooves. The second positioning strip further has a notch for engaging an indentation of a connecting element that comprises a substantially vertical portion with a hook hole for engaging the securing substrate of the CPU.

REFERENCES:
patent: 5357404 (1994-10-01), Bright et al.
patent: 5436798 (1995-07-01), Wieland, Jr.

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